FEM STUDY ON CREEPING FIBROUS COMPOSITE SiC/Al WITH APPLICATION IN ELECTRONIC, ELECTROMECHANICAL, AND ELECTRICAL COMPOSITE DEVICES

Creep can be dangerous for electromechanical, electronic and electrical connections, networks and devices. Recently, the metal matrix composites (MMC’s) are generally used for designing the electromechanical and electrical systems and devices due to their advantages. Therefore, analysis of the creep behavior is necessary and important for safe designing the fibrous composite devices. For achieving to this purpose, a numerical model is developed by FEM for predicting the micro-creep behavior of the fibrous composites with application in electromechanical, electronic, and electrical composite devices and systems. In present FEM model, determination of the creep behavior is easier than the available methods. So, predicting the creep behavior is noteworthy in order to design the electromechanical, electronic, and electrical composite devices and systems. For instance, electrical disconnection in the some systems may be because of the creep phenomenon. Also, analyzing the creep behavior is required for failure, fracture, and creep resistance of the electromechanical, electronic, and electrical composite devices and systems. Finally, the creep behavior is numerically predicted for a metal matrix composite (SiC/Al6061) by FEM.